Italian Semiconductor announced the launch of the ST4SIM-201 Machine to Machine Communication (M2M) embedded SIM (eSIM) chip, which complies with the latest 5G network access and M2M security specifications, as well as flexible remote activation management standards.

ST4SIM-201 complies with the ETSI/3GPP standard version 16 and can be connected to 5G independent networking (SA), as well as 3G and 4G networks, as well as low-power wide area (LPWA) network technology, such as Long Term Evolution of Machines (LTE-M) networks and Narrowband Internet of Things (NB IoT).

意法半导体5G M2M 嵌入式SIM卡芯片通过最新GSMA eSA(安全保障)认证

ST4SIM-201 has passed the latest GSMA eUICC M2M specification SGP.02 version 4.2 certification, which supports remote SIM card issuance to simplify card activation and maintenance work. The new product is the first SIM card chip to implement GSMA eUICC Security Assurance (eSA) using SGP.05 eUICC Protection Profile specification version 1.1. With this SIM chip, users can remotely switch operators without the need to connect the chip, simplifying logistics delivery, improving application flexibility, and helping to reduce user ownership costs throughout the card lifecycle. In addition, users can also use the test configuration files and emergency configuration files specified in SGP.02 specification version 4.2.

ST4SIM-201 is an industrial grade product that is very suitable for IoT applications and any device that requires cellular connectivity, including smart meters, asset trackers, health monitors, security equipment, telemetry equipment, security systems, and other intelligent IoT devices.

Adhere to the ETSI specification to ensure that the chip supports M2M application energy efficiency improvement functions, including power saving mode (PSM) and extended discontinuous reception (eDRX) mode, fully utilizing idle mode. ST4SIM-201 also supports ETSI specified suspend/resume commands to improve power management efficiency.

The ST4SIM-201 comes in a variety of packaging sizes to meet the requirements of different customers, including 5mm x 6mm DFN8 dual flat lead-free packaging and wafer level chip packaging (WLCSP), as well as standard 2FF, 3FF, and 4FF cards.