Intel CEO said if the United States does not approve a subsidy of 350 billion yuan, it will go to Europe to build chip factories
After taking office in February last year, Intel CEO Kissinger launched an ambitious IDM 2.0 strategy, hoping to regain the semiconductor position led by Samsung TSMC through significant investment. One important aspect is to invest $20 billion in the construction of two new wafer factories in the United States.
After taking office in February last year, Intel CEO Kissinger launched an ambitious IDM 2.0 strategy, hoping to regain the semiconductor position led by Samsung TSMC through significant investment. One important aspect is to invest $20 billion in the construction of two new wafer factories in the United States.
However, the plan to build a factory in Ohio, USA has been postponed by Intel, mainly due to the delayed implementation of the US $52 billion chip subsidy bill. Intel hopes to receive a large amount of subsidies to reduce the costs of chip factories.
According to news reports, Intel CEO Kissinger stated at a panel discussion at the Aspen Ideas Festival on August 28th that if the US Congress cannot approve the $52 billion government subsidy promised in the Chip Act for chip manufacturing, Intel may expand chip production in Europe instead of the United States.
Kissinger said at the seminar, "I hate to announce a postponement. He claimed that Intel wanted to "grow" in Ohio first, but without funds, Intel "would ultimately invest more in Europe as a result. Intel has planned to invest approximately $35 billion to expand its production in the European Union, including the construction of a $18 billion facility in Germany.
Kissinger also commented that the industry is "not seeking handouts", and subsidies under the chip bill will give the United States "comparable competitiveness to other regions of the world". Kissinger emphasized, "We have put our chips on the table to help the United States regain its leadership in process technology and manufacturing We plan to break ground on our wafer fab in Ohio this year, but there are many challenges ahead, and Congress needs to find a way forward with the 'Chip Act' before then. I hope to make progress faster Don't let Intel and the United States lose out on the wave of global semiconductor manufacturing localization.
It is worth mentioning that in late March of this year, when attending a congressional hearing on the chip bill, Kissinger expressed his dissatisfaction with the stagnant progress of the chip bill. Since the Senate took action last year, we have wasted several quarters, and now is the time for us to move forward quickly, "he said at the time.